Germany – Electromechanical equipment – Reactive ion etching

Opportunity description

For the projects currently being carried out at the chair, the fabrication of freestanding waveguides using "Faraday Cage Etching" is central. This complex process requires two completely different etching regimes in the same chamber. Accordingly, decoupled plasma density and ion energy (for p-i-n diode integration) are required. Further research projects require active helium backside cooling (for nanophotonic waveguides) to prevent "flowing" or burning of the electron-beam resist (E-beam resist). In additional projects, as well as in the post-processing of FIB-implanted defects, preserving crystal quality is the top priority. High-energy ion bombardment would damage the lattice and destroy the optical coherence of the color centers. Gentle removal of surface layers ("Soft Etch") without introducing new defects deep into the crystal is important. Finally, a pure oxygen plasma is required for structuring Solid Immersion Lenses (SILs) in diamond, while SiC requires fluorine chemistry (SF₆/CHF₃). Accordingly, a gas box with at least 5 lines for fluorine and oxygen processes is necessary in order to process both material classes without hardware modification. An "Open Load" design is also the most technically appropriate solution for the planned working method (processing small fragment samples on carrier wafers), since, unlike load-lock systems, it does not require complex adaptation of robotic handling systems to irregular sample geometries. Procedure: open. Review the original TED notice for the complete requirement, lots, amendments and attachments.