Germany – Miscellaneous general and special-purpose machinery – CMP-System 100/150‑mm‑Wafer (IAF-03) - PR1199438-2050-P
CMP-System 100/150‑mm‑Wafer (IAF-03) "CMP system for the chemical-mechanical polishing of dielectric layers such as silicon oxide on 100 mm and 150 mm Si and III-V semiconductor wafers with integrated cleaning and optical endpoint detection
Opportunity description
CMP-System 100/150‑mm‑Wafer (IAF-03) "CMP system for the chemical-mechanical polishing of dielectric layers such as silicon oxide on 100 mm and 150 mm Si and III-V semiconductor wafers with integrated cleaning and optical endpoint detection. The purpose of polishing is to achieve surface planarization and improve surface roughness in order to enable subsequent wafer fusion bonding of III-V semiconductors with Si wafers. " Option 1: Separate drainage lines for DI water and chemicals Option 2: SECS/GEM interface Option 3: Torque EPD Procedure: open. Review the original TED notice for the complete requirement, lots, amendments and attachments.
Business details are available after sign in
Codes, capabilities, evidence, buyer details and marketplace actions are withheld from the public HTML and API response.