Poland – Checking and testing apparatus – Supply of a device for separating semiconductor substrates into structures using laser cutting
The subject of the contract is the supply of a device for separating semiconductor substrates into structures using laser cutting. 1. The subject of the contract is the supply of a device for separating semiconductor substrates into structures using laser c
Opportunity description
The subject of the contract is the supply of a device for separating semiconductor substrates into structures using laser cutting. 1. The subject of the contract is the supply of a device for separating semiconductor substrates into structures using laser cutting. 2. A detailed description of the subject of the contract is set out in Annex No. 2 to the SWZ – Description of the subject of the contract. Procedure: open. Review the original TED notice for the complete requirement, lots, amendments and attachments.
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